Glass Core Substrate

Glass Core  

The excellent high frequency electrical characteristics and low cost for glass. Glass interposer plays a key part in 3D integrated passive components, MEMS packaging, embedded fan-out, and multichip package.
Group up is the leading company for providing equipment for TGV and SAP processes which are important processes to manufacture glass core substrate. 

TGV process flow 

Specifications: 
Size : 510mm x 515mm 
Thickness : 200um – 1800um 

SAP process flow

Specifications: 
Size : 510mm x 515mm 
Thickness : 200um – 1800um