PRODUCTS
TGV and Advance Packaging
DIP Coater
The development of FOPLP and glass substrate DIP coating equipment
"Group Up " has been closely collaborating with leading semiconductor companies on the development of FOPLP (Fan-Out Panel-Level Packaging) and glass substrate equipment, with a particular focus on joint development for DIP coating application equipment.
"Group Up " has been closely collaborating with leading semiconductor companies on the development of FOPLP (Fan-Out Panel-Level Packaging) and glass substrate equipment, with a particular focus on joint development for DIP coating application equipment.
Instructions
Features
- Full panel dipping
- Applicable for AP coating, PI coating, Varnish
- Customized JIG design for different panel size
- The filtration and circulation system operates full-time
Automation
- Combine with oven and other equipment for process need
- Comply with SECS/GEM standards
- Load and unload panels by EFEM
- Capable of handling 0.2-3mm glass panel
Dip Lifting arm
- Dip one panel each time
- Grinding-grade screw and servo motor for multi-stage programmable speed control
- Dipping speed setting range 0.1~50mm/sec
Soak Tank
- Soak tank inner volume - customized design for different panel size
- Dual-channel design for overflow circulation management
- Automatic ink addition
- External fencing with FFU on top to maintain cleanliness
Safety audit
- Comply to SEMI S2, S8 standards
- Comply to CE, UL standards
