PRODUCTS
TGV and Advance Packaging
Glass Core Substrate
The excellent high frequency electrical characteristics and low cost for glass.
Instructions
Glass Core
The excellent high frequency electrical characteristics and low cost for glass. Glass interposer plays a key part in 3D integrated passive components, MEMS packaging, embedded fan-out, and multichip package.
Group up is the leading company for providing equipment for TGV and SAP processes which are important processes to manufacture glass core substrate.
TGV process flow
Specifications:
Size : 510mm x 515mm
Thickness : 200um – 1800um
SAP process flow
Specifications:
Size : 510mm x 515mm
Thickness : 200um – 1800um
